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Gigabyte MB Sc LGA1700 B760 DS3H AX, Intel B760, 4xDDR5, 1xDP, 1xHDMI, WI-FI

3.490 CZK

Inkl. MwSt.

Der Preis enthält einen Recyclingbeitrag von 2 CZK

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Hersteller
GIGABYTE
Modell
B760 DS3H AX
Artikelnummer
IDS-683007
EAN
4719331852757

Komponente

Typ
Mainboard
Im Konfigurator verfügbarEinzeln erhältlich

Beschreibung

GIGABYTE B760 DS3H AX
Intel® Socket LGA 1700:Support 13th and 12th Gen Series Processors

Unparalleled Performance:Hybrid 8+2+1 Phases Digital VRM Solution

Dual Channel DDR5:4*DIMMs XMP Memory Module Support

Next Generation Storage:2*PCIe 4.0 x4 M.2 Connectors

EZ-Latch:PCIe 4.0x16 Slot with Quick Release Design

Fast Networks:GbE LAN & Wi-Fi 6E 802.11ax

Extended Connectivity:Rear USB-C® 20Gb/s, DP, HDMI

Smart Fan 6:Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP

Q-Flash Plus:Update BIOS Without Installing the CPU, Memory and Graphics Card

CPU

LGA1700 socket: Support for the 13th and 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processors
L3 cache varies with CPU
(Please refer "CPU Support List" for more information.)
Chipset

Intel® B760 Express Chipset
Memory

Support for DDR5 7600(O.C.) /7400(O.C.) /7200(O.C.) /7000(O.C.) /6800(O.C.) /6600(O.C.) / 6400(O.C.) / 6200(O.C.) / 6000(O.C.) / 5800(O.C.) / 5600(O.C.) / 5400(O.C.) / 5200(O.C.) / 4800 / 4000 MT/s memory modules
4 x DDR5 DIMM sockets supporting up to 192 GB (48 GB single DIMM capacity) of system memory
Dual channel memory architecture
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
Support for Extreme Memory Profile (XMP) memory modules
(The CPU and memory configuration may affect the supported memory types, data rate (speed), and number of DRAM modules, please refer to "Memory Support List" for more information.)
Onboard Graphics

Integrated Graphics Processor-Intel® HD Graphics support:
1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz

  • Support for HDMI 2.0 version and HDCP 2.3.
    1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz
  • Support for DisplayPort 1.2 version and HDCP 2.3
    (Graphics specifications may vary depending on CPU support.)
    Audio

Realtek® Audio CODEC
High Definition Audio
2/4/5.1/7.1-channel

  • You can change the functionality of an audio jack using the audio software. To configure 7.1-channel audio, access the audio software for audio settings.
    Support for S/PDIF Out
    LAN

Realtek® GbE LAN chip (1 Gbps/100 Mbps)
Wireless Communication module

Intel® Wi-Fi 6E AX210 (PCB rev. 1.0)
WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
BLUETOOTH 5.3
Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
Intel® Wi-Fi 6E AX211 (PCB rev. 1.1)
WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
BLUETOOTH 5.3
Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
Realtek® Wi-Fi 6E RTL8852CE (PCB rev. 1.2)
WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
BLUETOOTH 5.3
Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
(Actual data rate may vary depending on environment and equipment.)
Storage Interface

CPU:
1 x M.2 connector (Socket 3, M key, type 22110/2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU)
Chipset:
1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB)
4 x SATA 6Gb/s connectors
RAID 0, RAID 1, RAID 5, and RAID 10 support for SATA storage devices
USB

Chipset:
1 x USB Type-C® port on the back panel, with USB 3.2 Gen 2x2 support
1 x USB Type-C® port with USB 3.2 Gen 1 support, available through the internal USB header
1 x USB 3.2 Gen 2 Type-A port (red) on the back panel
2 x USB 3.2 Gen 1 ports available through the internal USB header
4 x USB 2.0/1.1 ports on the back panel
Chipset+2 USB 2.0 Hubs:
4 x USB 2.0/1.1 ports available through the internal USB headers
Internal I/O Connectors

1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
1 x CPU fan header
1 x CPU fan/water cooling pump header
3 x system fan headers
1 x system fan/water cooling pump header
2 x addressable LED strip headers
2 x RGB LED strip headers
2 x M.2 Socket 3 connectors
4 x SATA 6Gb/s connectors
1 x front panel header
1 x front panel audio header
1 x S/PDIF Out header
1 x USB Type-C® header, with USB 3.2 Gen 1 support
1 x USB 3.2 Gen 1 header
2 x USB 2.0/1.1 headers
1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)
1 x serial port header
1 x Q-Flash Plus button
1 x reset button
1 x reset jumper
1 x Clear CMOS jumper
Back Panel Connectors

1 x PS/2 keyboard/mouse port
2 x SMA antenna connectors (2T2R)
1 x USB Type-C® port, with USB 3.2 Gen 2x2 support
1 x USB 3.2 Gen 2 Type-A port (red)
4 x USB 2.0/1.1 ports
1 x HDMI port
1 x DisplayPort
1 x RJ-45 port
3 x audio jacks
I/O Controller

iTE® I/O Controller Chip
H/W Monitoring

Voltage detection
Temperature detection
Fan speed detection
Water cooling flow rate detection
Fan fail warning
Fan speed control

  • Whether the fan (pump) speed control function is supported will depend on the fan (pump) you install.
    BIOS

1 x 128 Mbit flash
Use of licensed AMI UEFI BIOS
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
Unique Features

Support for GIGABYTE Control Center (GCC)

  • Available applications in GCC may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications.
    Support for Q-Flash
    Support for Q-Flash Plus
    Bundled Software

Norton® Internet Security (OEM version)
LAN bandwidth management software
Operating System

Support for Windows 11 64-bit
Support for Windows 10 64-bit
Form Factor

ATX Form Factor; 30.5cm x 24.4cm

Socket/patice: 1700
Typ paměti: DDR5
Výrobce: Gigabyte

Technische Daten

Board-Sockel
LGA1700
Speichertyp
DDR5
Maximaler Speicher
20 GB
Frequenz
6.000 MHz
Maximale Auflösung
4096 × 2160
Schnittstelle
PCIe 4.0 x4
Formfaktor
ATX
Garantie (Monate)
36

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